As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified transportation—researchers at the National Renewable Energy Laboratory have unveiled a ...
At MWC 2026, Fibocom announced the industry's first implementation of Power Class 1 (PC1) modules based on both the MediaTek T930 and Qualcomm X85/X82 platforms, marking a major milestone in ...
Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal ...
The following article was originally published in eeNews Automotive. It is reprinted here with permission. Belgian company Cissoid has launched a three-phase silicon-carbide (SiC) intelligent power ...
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