A developer-targeting campaign leveraged malicious Next.js repositories to trigger a covert RCE-to-C2 chain through standard ...
Abstract: With the advancement of power modules toward high voltage and high power, the encapsulation reliability faced by power modules has attracted great attention under increasing electrical ...
Abstract: Wafer-level thin-film packaging offers high yield, low cost, and small packaging size and can be easily integrated into components within microelectromechanical systems (MEMS). In this work, ...
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